The Commercial Times has reported that the world’s largest contract chipmaker, Taiwan Semiconductor Manufacturing Company (TSMC), is planning a one- nanometer fab in Taoyuan. TSMC did not confirm or deny the reports but
said it would continue to invest in Taiwan’s advanced chip manufacturing.
The Hsinchu Science Park operates the new science park in Taoyuan’s Longtan District. The park did not comment on TSMC’s plans but said there will be many companies in the IC, photoelectric, and biotech industries operating there with about 7,000 employees. The estimated annual revenues for the new park will be NT$50 billion (US$1.5 billion).
The report said TSMC is already running two semiconductor packaging and testing factories at the Longtan tech park, which makes it an ideal place for one-nanometer chip production.
TSMC is planning to begin commercial production of its 3-nanometer process later this year. An upgraded version, known as 3nm enhanced (N3E), will begin commercial production a year later.
TSMC is planning to begin production of 2-nanometer chips by 2025, the same year Samsung and Intel plan to do so. It said it will build a 2-nanometer wafer plant in northern Taiwan's Hsinchu and later expand production to Taichung in central Taiwan.