TSMC’s first-quarter earnings conference is set to take place Thursday afternoon, drawing much attention from domestic and foreign investors.
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Nvidia CEO Jensen Huang visited Oregon State University in the United States to engage with students on AI trends. But Nvidia and Huang have competition from rivals like AMD. AMD has released its latest AI PC chip, claiming to be the leader in the commercial PC field and aiming to compete with Nvidia and Intel.
The research institution TrendForce reported that GB200, part of Nvida's Blackwell platform, and dubbed "the world's strongest AI chip," is expected to ship over one million units next year. This demand will also benefit TSMC’s CoWoS advanced packaging capacity, with an expected monthly production of 40,000 pieces by the end of this year, representing a year-on-year growth rate of over 150%.
Semiconductor experts say that although Intel is catching up with TSMC in advanced processes, it cannot keep up with customer demand. Samsung's current processes are also lagging behind, meaning all these orders are being taken by TSMC.
Demand for TSMC’s advanced packaging is soaring, but capacity is struggling to keep up. How TSMC responds to this demand will be a focal point at Thursday’s earnings conference. How far ahead is TSMC in technology compared to its competitors? Will U.S. factories erode profit margins? How will TSMC's global layout affect capital expenditure? These are likely to be questions from both domestic and global investors.
Taiwan Industry Economics Services (TIER) database Director Liu Pei-chen (劉佩真) is also concerned about whether inventory liquidation in other application areas can be completed by the end of the second quarter.
The countdown to TMSC’s earnings conference has begun, and it remains to be seen what latest news will be released, and whether it will reassure investors or inject more variables into the market.