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TSMC announces $100 billion additional investment in US semiconductor manufacturing

  • 04 March, 2025
  • Filip Leskovsky
TSMC announces $100 billion additional investment in US semiconductor manufacturing
TSMC Chairman and CEO C.C. Wei and President Donald Trump at the White House. (Photo: AFP)

TSMC Chairman and CEO C.C. Wei (魏哲家) and President Donald Trump jointly announced at the White House that TSMC plans to invest an additional US$100 billion in advanced semiconductor manufacturing in the U.S. This takes TSMC’s total U.S. investment to US$165 billion, making it the largest single foreign direct investment in U.S. history. The investment includes building three new wafer fabs, two advanced packaging facilities, and a major R&D center.

The expanded investment is anticipated to generate hundreds of billions of dollars in semiconductor value for AI and other cutting-edge applications. It will support approximately 40,000 construction jobs over the next four years and create tens of thousands of high-paying, high-tech jobs in advanced chip manufacturing and R&D. The investment is projected to drive over US$200 billion in indirect economic output across Arizona and the U.S. over the next decade. The move highlights TSMC’s commitment to supporting American AI and tech innovation companies, including Nvidia, Apple, Qualcomm, AMD and Broadcom Inc.

Taiwan Premier Cho Jung-tai (卓榮泰) says the government welcomes initiatives that enhance the industry’s global deployment and improve national competitiveness. He emphasized the shared position of government and industry to keep roots in Taiwan while continuing to strengthen the country. Economic Minister J.W. Kuo (郭智輝) says the investment will not shift Taiwan’s key role in chip production, dismissing concerns that TSMC could potentially become “ASMC” (American Semiconductor Manufacturing Company) as unnecessary. He says the investment scale is not enough to entirely relocate supply chains to the U.S.

TSMC has reassured stakeholders that its investment plans in Taiwan remain unchanged. The company will continue expanding its 3nm process capacity at the Tainan Science Park and is preparing to establish multi-stage 2nm fabs in Hsinchu and Kaohsiung Science Parks to support strong customer demand. The company also confirmed that its Japanese investment plans will proceed as scheduled, with the second fab beginning in 2025. TSMC maintains that it will continue its sustainable, stable, and gradually increasing dividend policy despite the significant U.S. investment.

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